As electronic devices become more powerful and compact, managing heat dissipation in PCBs has become a critical challenge. Traditional thermal management techniques like thermal vias and thick copper layers often fall short in high-power applications.

To overcome this, Copper Coin Technology is used to embed solid copper pieces (coins) inside the PCB, creating a direct thermal path for heat dissipation. This technique enhances reliability, prevents overheating, and improves electrical performance.

What is Copper Coin Technology in PCB ?
Copper Coin Technology is a PCB heat dissipation method where solid copper inserts (coins) are placed within the PCB to create a highly conductive path for heat transfer.

Unlike traditional thermal vias, which rely on indirect heat transfer, copper coins provide a direct and efficient thermal path from the heat-generating components to other PCB layers or external cooling solutions.

Why is Copper Coin Technology ?
It Replaces traditional PCB thermal management methods include:
- Thermal Vias – Inefficient in high-power applications.
- Thicker Copper Layers – Increases PCB cost and weight.
- Metal Core PCBs (MCPCB) – Not suitable for complex multilayer designs.

Key Reasons to Use Copper Coins
- Better Heat Dissipation – Transfers heat faster and more efficiently.
- Improved Electrical Conductivity – Reduces resistance for high-current applications.
- Stronger PCB Structure – Prevents warping and mechanical stress.
- No Need for External Heat Sinks – Reduces component count and assembly complexity.

Conventional Vias and Copper Coin Technology in PCB Thermal Management
Fig.56 :Conventional Vias and Copper Coin Technology in PCB Thermal Management


Types of Copper Coins in PCBs
1. Embedded Copper Coin
- The copper coin is placed inside a cavity in the PCB and is partially exposed on the outer surface.
- Provides direct thermal contact between components and the PCB’s internal layers.
- Best for high-power applications like MOSFETs, power amplifiers, and processors.

2. Buried Copper Coin
- The copper coin is completely enclosed within the PCB and not visible on the surface.
- Used in multilayer PCBs to transfer heat between inner layers.
- Ideal for high-density electronic systems like automotive, aerospace, and defence.

3. Press-Fit Copper Coin
- The copper coin is tightly pressed into a pre-machined cavity in the PCB.
- Ensures a strong mechanical and thermal connection without soldering.
- Best for applications requiring both thermal and mechanical stability.

4. Soldered Copper Coin
- The copper coin is soldered directly onto the PCB for better thermal and electrical conductivity.
- Often used in RF PCBs, power supply units, and high-frequency circuits.


How is Copper Coin Technology Implemented?
PCB Design & Slot Creation
- The PCB is designed with precise cavities or slots for copper coins.
- The size and placement are determined based on heat dissipation requirements.

Copper Coin Preparation
- Solid copper pieces (coins) are machined to the required shape and size.

Copper Coin Insertion & Bonding
- Depending on the type, the copper coin is:
- Embedded or buried inside the PCB
- Press-fitted into a cavity
- Soldered for electrical and thermal contact

PCB Finishing & Testing
- The PCB undergoes surface finishing (ENIG, OSP, or Immersion Silver).
- Thermal and electrical testing is performed to ensure proper heat conduction.

Advantages of Copper Coin Technology
Superior Heat Dissipation
Reduced PCB Temperature
Improved Electrical Conductivity
Stronger PCB Structure
No Need for Additional Heat Sinks

Challenges and Disadvantages of Copper Coin Technology
Higher Manufacturing Cost
Complex Fabrication Process
Potential Reliability Issues
Potential Reliability Issues



 Page-13 | Page-14 | Page-15 (Upcoming)